경화제 제품7종
| 품명 | 용도 | 화학 구성 / 형상 | 첨가량 (phr) | 주요 적용 |
|---|---|---|---|---|
| SC-88 | 일반 몰딩용 | 2,5-Bis(t-butylperoxy)-2,5 dimethylhexane (Liquid, 92%) | 0.4 ~ 0.5 | General molding, Conductive rubber molding, all compression molding |
| SC-88BH | 일반 몰딩용 | 2,5-Bis(t-butylperoxy)-2,5 dimethylhexane (Gum type, 46%) | 0.8 ~ 1.0 | General molding, Conductive rubber molding, all compression molding |
| DCP MB | 일반 몰딩용 | Dicumyl peroxide (Paste, 25%) | 1.5 ~ 2.0 | General molding, Steam cure, compression molding for high elasticity |
| SC-9 | 무취 (식품 접촉용) | Di(tert-butyl) peroxide (Liquid, 98%) | 0.8 ~ 1.2 | Curing agent for Odorless & Food contact |
| SC-9BH (화재 방지용) | 무취 (식품 접촉용) | Di(tert-butyl) peroxide (Gum type, 48%) | 1.2 ~ 1.6 | Curing agent for Odorless & Food contact |
| SC-2 | 압출용 | Bis(2,4-dichlorobenzoyl) peroxide (Paste, 50%) | 1.2 ~ 1.8 | HAV, Coating thick section molding |
| SC-3 | 압출용 | Bis(4-methylbenzonyl) peroxide (Paste, 50%) | 1.6 ~ 2.2 | HAV, Non-including chloride |
← 표를 좌우로 밀어서 보세요 →
기술 자료 다운로드
경화제·첨가제 기술 자료(영문 PDF)입니다.